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COMSOL Multiphysics is a public-designed software based on advanced numerical patterns for use in modeling and simulating physics-based issues. Using this software, you will be able to compute the behavior of different or interconnected physical models. With more than 30 sections added to the software, you can use the simulation space with a variety of physical connections and tools to carry out electrical, mechanical, fluid and chemical projects. Also, the software-designed interface provides the ability to link COMSOL Multiphysics simulations to technical computing software such as CAD and ECAD.
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This software provides an integrated and powerful environment for the development of related products using a single workflow, regardless of their differences in the software environment. The software development modules are integrated seamlessly and, depending on your use of different software and applications, it is used in the same software environment. Model tree and Model Builder tools provide a general overview of the simulation model and allow you to access all features such as object geometry, object-forming boundaries, and physical properties, networking, chemical solvents, and illustration. With the COMSOL Multiphysics simulation software, you can develop and interpret conventional and common models with any physical attributes to physical multimode models that can display their interactions with each other.
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how to model crack in comsol with contact pair??
Posted Feb 10, 2011, 8:53 AM ESTGeometry, Modeling Tools, Parameters, Variables, & Functions, Structural Mechanics & Thermal StressesVersion 3.5a, Version 4.1, Version 4.24 Replies
Deepak
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Hi,
I made a crack in plate with ellipsoid on surface,but i am not able to create a contact pair at the crack interface.
pls help!!
Thanks!!
Deepak
I made a crack in plate with ellipsoid on surface,but i am not able to create a contact pair at the crack interface.
pls help!!
Thanks!!
Deepak
Ivar KjelbergCSEM SA (CH)
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Hi
I'm not sure a 'contact pair' is the easiest physics to apply for crack propagation, as a contact pair is a BC tht is free in one directionand compressive in the other, while a crack has some adhesion until you pass a limit (of rupture) and then it passes the (mostly pulling) stress further 'down the line'. There is an example with a crack propagation in the 3.5 examples, perhaps not yet in the v4, will certainly arrive soon, try an upodate of the mdoel library
--
Good luck
Ivar
I'm not sure a 'contact pair' is the easiest physics to apply for crack propagation, as a contact pair is a BC tht is free in one directionand compressive in the other, while a crack has some adhesion until you pass a limit (of rupture) and then it passes the (mostly pulling) stress further 'down the line'. There is an example with a crack propagation in the 3.5 examples, perhaps not yet in the v4, will certainly arrive soon, try an upodate of the mdoel library
--
Good luck
Ivar
Ramgopal Balijepalli
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Hello Ivar,
I am dealing with a similar problem. In my case two surfaces are adhered strongly and I would like to model the crack propagation in the contact area of the two surfaces when a tensile force is applied to the non adhering surface. I searched in the model library but haven't found any information in this regard except the example suggested by you.
Any suggestions or help would be highly appreciated.
Best Regards,
Ramgopal
I am dealing with a similar problem. In my case two surfaces are adhered strongly and I would like to model the crack propagation in the contact area of the two surfaces when a tensile force is applied to the non adhering surface. I searched in the model library but haven't found any information in this regard except the example suggested by you.
Any suggestions or help would be highly appreciated.
Best Regards,
Ramgopal
Aaron Quastel
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Download Comsol Multiphysics Free Crack
Have you found anything on this, such as applying the j-integral?
Ramgopal Balijepalli
Comsol Multiphysics 5.3 User Manual
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Comsol Multiphysics Examples
Unfortunately I haven't found anything till now.